Microstructure evolution and shear behavior of Au–Sn/Ni–xCo (x = 20, 40, 60, and 80 at.%) joints soldered at 350 °C
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DOI: 10.1007/s10854-017-6413-9
Abstract: Interfacial reaction and shear behavior of the joints between the Au–29Sn (at.%) solder and the Ni–xCo (x = 20, 40, 60, and 80 at%) alloys soldered at 350 °C for various durations were investigated in this study. The results… read more here.
Keywords: ni3sn2 layer; thickness ni3sn2; xco joints; soldered 350 ... See more keywords